4. Electricity: measuring and testing
  5. Plural, automatically sequential tests

Edmund J. Sprogis

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Conductive through via process for electronic device carriers

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Conductive through via structure and process for electronic...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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Dual chip stack method for electro-static discharge...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Dual chip with heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat sink for integrated circuit devices

Electrical resistors – With heat dissipating projections
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Profile ID: LFUS-PAI-P-337831

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