Dual chip stack method for electro-static discharge...

Details Dual chip stack method for electro-static discharge... Dual chip stack method for electro-static discharge...

2006-06-27

2006-06-27

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S777000, C257S320000, C257S203000

Reexamination Certificate

active

07067914

ABSTRACT:
Disclosed is an electronic device comprising a semiconductor chip including an integrated circuit having at least one electrostatic discharge sensitive device and a non-semiconductor chip, positioned in close proximity to the semiconductor chip, the non-semiconductor chip having at least one electrostatic discharge protection device. The electrostatic discharge protection device is electrically connected to the electrostatic discharge sensitive device.

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patent: 6180426 (2001-01-01), Lin
patent: 6198136 (2001-03-01), Voldman et al.
patent: 6493198 (2002-12-01), Arledge et al.
Wallash et al., ESD Failure Mechanisms of Inductive and Magnetoresistive Recording Heads, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1995, Sep. 12-14, 1995, pp. 322-330.

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