4. Printing
  5. Processes
  6. With heating or cooling

Edgar R. Zuniga

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Bonding over integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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High aspect ratio integrated circuit chip and method for produci

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Integrated circuit chip packaging method

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent

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Laser symbolization on copper heat slugs

Printing – Processes – With heating or cooling
Patent

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Profile ID: LFUS-PAI-P-144408

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