4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Dong-You Kim

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BGA package using a dummy ball and a repairing method thereof

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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BGA package using a dummy ball and a repairing method thereof

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent

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Bottom lead frame and bottom lead semiconductor package using th

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Profile ID: LFUS-PAI-P-140148

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