4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Donald S. Fritz

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Integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Integrated circuit package fabrication method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent

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Semiconductor package with stress inhibiting intermediate...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Semiconductor package with stress inhibiting intermediate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Structure and material for assembling a low-K Si die to...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1524538

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