Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1995-11-17
1998-04-28
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438112, 438125, H01L 2160
Patent
active
057443831
ABSTRACT:
A leadframe integrated circuit package is provide with an interposer structure for electrically interconnecting a die with the leadframe. The interposer has a rigid substrate, which is mounted in the leadframe in place of a conventional integrated circuit die. Interposer bonding pads at the periphery of the substrate are connected to bond fingers of the leadframe, e.g., by wire bonding. The interposer bonding pads are electrically connected to the die using a network of routing lines connected to a central array of interposer array pads. The array of interposer array pads is connected to a corresponding array of die array pads on the die using metal bumps.
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Altera Corporation
Jackson Robert R.
Picardat Kevin
Treyz G. Victor
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