Integrated circuit package

Details Integrated circuit package Integrated circuit package

1995-10-24

1998-05-26

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257676, 257723, 257796, H01L 23495

Patent

active

057570701

ABSTRACT:
An integrated circuit package in which the lead fingers are spaced away from the heat slug is provided. This allows the area of the heat slug to be used for a metallized contact area to serve as a power plane, ground plane, signal bus or the like. The metallized area is preferably insulated from the slug by a ceramic layer. The ceramic layer is preferably adhered to the slug by a nonconductive adhesive, and the metallized layer is preferably a sheet of metal that is preferably adhered to the ceramic layer by a preferably nonconductive adhesive. Nonconductive adhesive can also be used in place of the ceramic layer as an insulating layer. The package preferably also includes an interposer in the windowframe formed around the die by the ceramic layer, with the interposer adhered to the slug by a preferably nonconductive adhesive. More than one interposer, and more than one metallized layer or area, may also be provided.

REFERENCES:
patent: 5196725 (1993-03-01), Mita et al.
patent: 5365409 (1994-11-01), Kwon et al.
patent: 5455453 (1995-10-01), Harada et al.
patent: 5633529 (1997-05-01), Otsuki
Amkor Electronics, Inc. "PowerQuad1.sup.198 Data Sheet, " May 1993.
Amkor Electronics, Inc. "PowerQuad2.sup.198 Data Sheet," May 1993.
Shinko Electric Industries Co., Ltd., "HyperQuad Series--Type 2, Die Pad Heat Spreader QFP," Jun. 1994.
Shinko Electric Industries Co., Ltd., "HyperQuad Series--Type 2, Three Metal Layer QFP," Jun. 1994.
Worltek International Limited, "ASAT.RTM. EdQuad Construction," undated.
Worltek International Limited, "ASAT.RTM. Ed Quad Cross Section," undated.

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