4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Donald Farrell

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Integrated circuit with substantially perpendicular wire bonds

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Integrated circuit with substantially perpendicular wire bonds

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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RF power transistor packages with internal harmonic...

Wave transmission lines and networks – Coupling networks – With impedance matching
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2932875

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