Integrated circuit with substantially perpendicular wire bonds

Details Integrated circuit with substantially perpendicular wire bonds Integrated circuit with substantially perpendicular wire bonds

2006-09-19

2006-09-19

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S531000, C257S779000, C257S780000, C257S781000, C257S786000, C361S704000, C361S707000, C228S180500

Reexamination Certificate

active

07109589

ABSTRACT:
An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for at least one of the circuit elements. At least one wire bond in a first subset of wire bonds and at least one wire bond in a second subset of wire bonds are substantially perpendicular to one another at a crossing point of the wire bonds in a plan view of the integrated circuit.

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