Integrated circuit with substantially perpendicular wire bonds

Details Integrated circuit with substantially perpendicular wire bonds Integrated circuit with substantially perpendicular wire bonds

2006-07-27

2008-12-16

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21506, C228S004500

Reexamination Certificate

active

07465655

ABSTRACT:
A method for performing a wire-bonding operation in an integrated circuit utilizes a bonding tool. A wire is bonded to a first bond site in the integrated circuit, and terminated at a second bond site in the integrated circuit. The bonding and terminating steps are repeated for a plurality of additional wire bonds of the integrated circuit. At least two wire bonds in the integrated circuit are substantially perpendicular to one another at a crossing point in a plan view of the integrated circuit.

REFERENCES:
patent: 4393392 (1983-07-01), Hale
patent: 5205463 (1993-04-01), Holdgrafer et al.
patent: 5488252 (1996-01-01), Johansson et al.
patent: 6077753 (2000-06-01), Johansson et al.
patent: 6414389 (2002-07-01), Hume et al.
patent: 7074705 (2006-07-01), Miller et al.
patent: 2004/0061214 (2004-04-01), Crescenzi, Jr.

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