4. Cleaning and liquid contact with solids
  5. Apparatus
  6. With means to movably mount or movably support the work or...

Dean Paul Kossives

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active

Air isolated crossovers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Chip carrier and fabrication method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Chip carrier and fabrication method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Cleaning solder-bonded flip-chip assemblies

Cleaning and liquid contact with solids – Apparatus – With means to movably mount or movably support the work or...
Patent

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Flip chip bump bonding

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1721234

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