Cleaning solder-bonded flip-chip assemblies

Details Cleaning solder-bonded flip-chip assemblies Cleaning solder-bonded flip-chip assemblies

1997-02-20

1998-07-14

Coe, Philip R.

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

134902, B08B 302

Patent

active

057789134

ABSTRACT:
Cleaning of a micromimiature high-density flip-chip assembly is carried out by spinning the assembly while applying cleaning fluid to a central portion of the assembly. Confinement of the cleaning fluid to a critical interconnection space of the assembly is ensured by a centrally apertured cover that resiliently engages the top of the assembly. During spinning, cleaning fluid is introduced through the aperture in the cover and is directed into and confined to flow radially in the interconnection space.

REFERENCES:
patent: 4021278 (1977-05-01), Hood et al.
patent: 5489341 (1996-02-01), Bergman et al.

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