Chip carrier and fabrication method

Details Chip carrier and fabrication method Chip carrier and fabrication method

2009-02-25

2010-06-08

Zarroli, Michael C (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S260000

Reexamination Certificate

active

07733661

ABSTRACT:
A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.

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