4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

David Michael Passante

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Apparatus and process for improved die adhesion to organic chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Method and structure for constraining the flow of incapsulant ap

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
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Structure for constraining the flow of encapsulant applied to an

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-182291

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