Structure for constraining the flow of encapsulant applied to an

Details Structure for constraining the flow of encapsulant applied to an Structure for constraining the flow of encapsulant applied to an

1996-05-29

1998-07-21

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174250, 257723, 361761, 361777, 361783, H05K 118, H05K 702

Patent

active

057842604

ABSTRACT:
According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.

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