Method and structure for constraining the flow of incapsulant ap

Details Method and structure for constraining the flow of incapsulant ap Method and structure for constraining the flow of incapsulant ap

1998-03-17

1999-02-09

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438124, 438125, 438106, H01L 2156

Patent

active

058693564

ABSTRACT:
According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.

REFERENCES:
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patent: 5051813 (1991-09-01), Schneider et al.
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patent: 5409863 (1995-04-01), Newman
patent: 5663106 (1997-09-01), Karavakis et al.
patent: 5766982 (1998-06-01), Akram et al.

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