Apparatus for controlling wafer temperature in chemical...

Details Apparatus for controlling wafer temperature in chemical... Apparatus for controlling wafer temperature in chemical...

2006-04-18

2006-04-18

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S053000, C451S060000, C451S288000

Reexamination Certificate

active

07029368

ABSTRACT:
Apparatus controls the temperature of a wafer for chemical mechanical polishing operations. A wafer carrier wafer mounting surface positions a wafer adjacent to a thermal energy transfer unit for transferring energy relative to the wafer. A thermal energy detector oriented adjacent to the wafer mounting surface detects the temperature of the wafer. A controller is responsive to the detector for controlling the supply of thermal energy relative to the thermal energy transfer unit. Embodiments include defining separate areas of the wafer, providing separate sections of the thermal energy transfer unit for each separate area, and separately detecting the temperature of each separate area to separately control the supply of thermal energy relative to the thermal energy transfer unit associated with the separate area.

REFERENCES:
patent: 3874123 (1975-04-01), Hopkins et al.
patent: 4197676 (1980-04-01), Sauerland
patent: 4600469 (1986-07-01), Fusco et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 5196353 (1993-03-01), Sandhu et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5508077 (1996-04-01), Chen et al.
patent: 5597442 (1997-01-01), Chen et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5643050 (1997-07-01), Chen
patent: 5647952 (1997-07-01), Chen
patent: 5873769 (1999-02-01), Chiou et al.
patent: 5882244 (1999-03-01), Hiyama et al.
patent: 5888120 (1999-03-01), Doran
patent: 5916015 (1999-06-01), Natalicio
patent: 5958148 (1999-09-01), Holzapfel et al.
patent: 5969521 (1999-10-01), Kurita et al.
patent: 5972162 (1999-10-01), Cesna
patent: 5985094 (1999-11-01), Mosca
patent: 5993302 (1999-11-01), Chen et al.
patent: 6012964 (2000-01-01), Arai et al.
patent: 6030488 (2000-02-01), Izumi et al.
patent: 6056632 (2000-05-01), Mitchel et al.
patent: 6077151 (2000-06-01), Black et al.
patent: 6106662 (2000-08-01), Bibby, Jr. et al.
patent: 6110012 (2000-08-01), Maury et al.
patent: 6110026 (2000-08-01), Arai
patent: 6150271 (2000-11-01), Easter et al.
patent: 6224461 (2001-05-01), Boehm, Jr. et al.
patent: 6227939 (2001-05-01), Monroe
patent: 6264789 (2001-07-01), Pandey et al.
patent: 6375540 (2002-04-01), Mikhaylich et al.
patent: 6682404 (2004-01-01), Brunelli
patent: 6726529 (2004-04-01), Marcyk et al.
patent: 2001/0046831 (2001-11-01), Wise et al.
patent: 60201868 (1985-12-01), None
patent: 60 201868 (1995-05-01), None
patent: 09097829 (1997-08-01), None
patent: 2000343415 (2000-12-01), None

Affiliated with

Also associated with

Rating

Apparatus for controlling wafer temperature in chemical... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for controlling wafer temperature in chemical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for controlling wafer temperature in chemical... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3528802