4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Dave S. Mahadevan

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active

Lead frame with flag support structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Method of forming a semiconductor package and structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Package for electrical components having a molded structure with

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Profile ID: LFUS-PAI-P-1328486

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