Package for electrical components having a molded structure with

Details Package for electrical components having a molded structure with Package for electrical components having a molded structure with

1994-06-30

1997-11-11

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257433, 257434, 257693, 257787, 257666, 257670, 361760, 361772, 361813, H01L 2302, H01L 310203

Patent

active

056866984

ABSTRACT:
A package for mounting electrical components and a method for making the package. A mold structure (50) is formed by encapsulating a portion of a leadframe (10) with a molding compound. Leads (23) project from one side of the mold structure and a portion of a tab (27) projects from another side of the mold structure, which has a cavity (57) between the leads (23) and the tab (27). In addition, the mold structure has vent holes (76) between the leads (23) and an aperture (62) extending to the cavity. After mounting a semiconductor chip (64) in the cavity (57), it is covered by a lid (53) and a portion (24) of the leads (23) and a portion (29) of the tab (27) are formed. The tab (27) provides structural rigidity to the mold structure (50) and permits surface mounting the mold structure (50).

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