4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Damon K. DeBusk

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Manufacturing method for wafer slice starting material to optimi

Semiconductor device manufacturing: process – Gettering of substrate – By layers which are coated – contacted – or diffused
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Manufacturing method for wafer slice starting material to optimi

Semiconductor device manufacturing: process – Gettering of substrate – By layers which are coated – contacted – or diffused
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method and device for removing a thin film from a wafer backside

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for forming active devices on and in exposed surfaces of

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method of reducing mobile ion contaminants in semiconductor film

Semiconductor device manufacturing: process – Gettering of substrate
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Damon K. DeBusk does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Damon K. DeBusk, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Damon K. DeBusk will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-857362

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure