4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Conrad J. Dell'Oca

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Apparatus for isolation of flux materials in "flip-chip" manufac

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Double metal HCMOS compacted array

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Method and apparatus for isolation of flux materials in "flip-ch

Metal working – Method of mechanical manufacture – Electrical device making
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Method and apparatus for isolation of flux materials in flip-chi

Metal fusion bonding – Process – Plural joints
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Method and apparatus for isolation of flux materials in flip-chi

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Profile ID: LFUS-PAI-P-735549

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