4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Conrad J. Dell'Oca

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Apparatus for isolation of flux materials in "flip-chip" manufac

Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Double metal HCMOS compacted array

Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method and apparatus for isolation of flux materials in "flip-ch

Metal working – Method of mechanical manufacture – Electrical device making
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method and apparatus for isolation of flux materials in flip-chi

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method and apparatus for isolation of flux materials in flip-chi

Metal fusion bonding – Process – Plural joints
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Conrad J. Dell'Oca does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Conrad J. Dell'Oca, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conrad J. Dell'Oca will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-735549

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure