4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Claude Pouet

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Device for assembling semiconductor chips between two heat sinks

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Device for assembling semiconductor chips between two heat sinks

Metal fusion bonding – With means to handle work or product – Work portion comprises electrical component
Patent

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Device for assembling semiconductor chips between two heat sinks

Metal fusion bonding – With means to handle work or product – Including means to orient work or position work portion...
Patent

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Support structure for power element

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-549129

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