Device for assembling semiconductor chips between two heat sinks

Details Device for assembling semiconductor chips between two heat sinks Device for assembling semiconductor chips between two heat sinks

1994-08-12

1995-10-31

Bradley, P. Austin

Metal fusion bonding

With means to handle work or product

Work portion comprises electrical component

29740, B23K 3704

Patent

active

054622190

ABSTRACT:
A device for mounting chips between two flat heat sinks includes a base provided with an assembly of ramps disposed in a saw-tooth pattern; a plurality of main stops aligned at the bottom of the ramps and open in a direction toward the top of the ramps; and, for each main stop, a median stop protruding from the main stop and dividing it into two sub-stops, each sub-vee for receiving a heat sink disposed in parallel with the associated ramp, the median stop being designed to accommodate a chip.

REFERENCES:
patent: 4868974 (1989-09-01), Masanori
patent: 4956911 (1990-09-01), Zaremba et al.
patent: 5351873 (1994-10-01), Pouet et al.

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