Device for assembling semiconductor chips between two heat sinks

Details Device for assembling semiconductor chips between two heat sinks Device for assembling semiconductor chips between two heat sinks

1993-06-25

1994-10-04

Bradley, P. Austin

Metal fusion bonding

With means to handle work or product

Including means to orient work or position work portion...

228 495, 29760, B23K 3704

Patent

active

053518730

ABSTRACT:
A device for mounting chips between two flat heat sinks includes a base provided with an assembly of ramps disposed in a saw-tooth pattern; a plurality of main stops aligned at the bottom of the ramps and open in a direction toward the top of the ramps; and, for each main stop, a median stop protruding from the main stop and dividing it into two sub-stops. Each sub-stop, in the shape of a sub-vee, is for receiving a heat sink disposed in parallel with the associated ramp, and the median stop is designed to accommodate a chip.

REFERENCES:
patent: 4868974 (1989-09-01), Nishiguchi
patent: 4956911 (1990-09-01), Zaremba et al.

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