4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Chun Ho Fan

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active

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Ball grid array package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Ball grid array package and process for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Ball grid array package and process for manufacturing same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Ball grid array package and process for manufacturing same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2371516

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