4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Chul Jeong

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active

Adhesive film composition, associated dicing die bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
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Apparatus and method of removing particles

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
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Method of fabricating liquid crystal display device

Liquid crystal cells – elements and systems – Nominal manufacturing methods or post manufacturing...
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Methods of forming semiconductor devices having a trench...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Methods of forming semiconductor devices having a trench...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2244615

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