4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Chirag S. Patel

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Apparatus and method for thermal isolation, circuit cooling...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Compliant wafer-level packaging devices and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

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Conductive through via process for electronic device carriers

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Conductive through via structure and process for electronic...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
Reexamination Certificate

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Devices having compliant wafer-level packages with pillars...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2597101

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