Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-04-25
2006-04-25
Everhart, Caridad (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S411000, C438S422000, C257S709000
Reexamination Certificate
active
07033927
ABSTRACT:
The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the thermal path between the two regions is lengthened. In addition, the vias may be fully or partially filled with an insulating material having defined conductive properties to further retard heat electromagnetic or heat transmission between the regions. In another embodiment, electrical isolation between two regions is achieved by etching a closed loop or an open loop trench at the border of the regions and filling the trench with a conductive material to provide proper termination of electromagnetic fields within the substrate.
REFERENCES:
patent: 6100199 (2000-08-01), Joshi et al.
patent: 2002/0033189 (2002-03-01), Macris
Wu, J.H., et al., “A Faraday Cage Isolation Structure for Substrate Crosstalk Suppression,” IEEE Microwave and Wireless Components Letters, vol. 11, No. 10, Oct. 2001.
Soh, H.T., et al., “Ultra-Low Resistance, Through-Wafer VIA (TWV) Technology and its Applications in Three Dimensional Structures on Silicon,” Japanese Journal of Applied Physics, vol. 38, 1999.
Wu, j., et al., “A High Aspect Ratio Silicon Substrate-Via Technnology and Applications: Through-Wafer Interconnects for Power and Ground and Faraday Cages for SOC Isolation,” IEDM, 2000.
Cohen Guy M.
Edelstein Daniel C.
Jenkins Keith A.
Patel Chirag S.
Shan Lie
Duane Morris LLP
Everhart Caridad
International Business Machines - Corporation
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