Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Board-on-chip type substrates with conductive traces in...
Interconnecting substrates for microelectronic dies, methods...
Lead frame-based semiconductor device packages incorporating...
Metal core foldover package structures
Methods of fabrication of lead frame-based semiconductor...
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Profile ID: LFUS-PAI-P-2271920