4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Responsive to non-electrical signal
  6. Physical deformation

Chin-Horng Wang

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active

Chip package structure and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Inkjet printhead and process for producing the same

Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate

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Inkjet printhead and process for producing the same

Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate

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MEMS structure with suspended microstructure that includes...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Method for measuring the etching speed

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2206941

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