4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Chihiro Araki

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Inspection method and inspection apparatus for semiconductor...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Semiconductor chip soldering land pattern

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Wire bonding method and apparatus therefor

Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2670295

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