Wire bonding method and apparatus therefor

Details Wire bonding method and apparatus therefor Wire bonding method and apparatus therefor

2002-05-21

2008-12-16

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

With condition responsive, program, or timing control

C228S110100, C228S180500

Reexamination Certificate

active

07464851

ABSTRACT:
Methods and apparatus for detecting the welding state in each bonding section and the application of ultrasonic vibration and pressing force is stopped promptly when completion of welding is determined. This permits bonding to be finished, corresponding to each wire bonding section at all times, in a shortest time without need of application of unnecessary ultrasonic vibration and pressing force after completion of welding in spite of dispersion of the welding characteristic of the individual bonding pads.

REFERENCES:
patent: 5002217 (1991-03-01), Tani et al.
patent: 5148964 (1992-09-01), Shimizu
patent: 5323952 (1994-06-01), Kato et al.
patent: 5431324 (1995-07-01), Kajiwara et al.
patent: 5433369 (1995-07-01), Okumura
patent: 7-29944 (1995-01-01), None
patent: 8-288327 (1996-11-01), None

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