4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...
  6. Combined with the removal of material by nonchemical means

Chia-Hui Wu

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Bonding pad and chip structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Casing for electronic devices and method for producing the same

Receptacles – Sectional – Container formed of only two similar sections
Reexamination Certificate

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Method to prevent CMP overpolish

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Semiconductor device with bump electrodes

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2034774

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