Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-08-16
2005-08-16
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
active
06929980
ABSTRACT:
A manufacturing method of a flip chip package mainly comprises the following steps. Initially, a chip having an active surface with a plurality of bumps formed thereon is provided. Next, the active surface of the chip is faced to and disposed on an upper surface of a substrate. In such manner, the chip will be electrically connected to the substrate and a gap between the chip and the substrate will be formed. Afterwards, an underfill is filled in the gap and then a first curing process is performed to have the underfill partially hardened to have the underfill transformed into a partially hardened underfill. Finally, the combination of the chip, the substrate and the partially hardened underfill is flipped over to have the substrate located above the chip, then a second curing process is performed to have the partially hardened underfill into a fully hardened underfill, and then flipping over the combination of the chip, the substrate and the fully hardened underfill.
REFERENCES:
patent: 2002/0142514 (2002-10-01), Scheifers et al.
patent: 2003/0059978 (2003-03-01), Suzuki et al.
patent: 2003/0141582 (2003-07-01), Yang et al.
Chao Chi-Sheng
Chen Yu-Wen
Chiu Chi-Hao
Chuang Chi-Ta
Advanced Semiconductor Engineering Inc.
Bacon & Thomas
Harrison Monica D.
Thompson Craig A.
LandOfFree
Manufacturing method of flip chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method of flip chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of flip chip package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3498782