4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Cheol-Joon Yoo

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Method and apparatus for picking up a semiconductor chip,...

Material or article handling – Device for emptying portable receptacle – Nongravity type
Reexamination Certificate

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Method and apparatus for picking up a semiconductor chip,...

Material or article handling – Device for emptying portable receptacle – Nongravity type
Reexamination Certificate

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Method and apparatus for picking up a semiconductor chip,...

Material or article handling – Device for emptying portable receptacle – Nongravity type
Reexamination Certificate

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Protective tape removing apparatus and method of assembling...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Semiconductor device and method of packaging the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2183471

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