Semiconductor device and method of packaging the same

Details Semiconductor device and method of packaging the same Semiconductor device and method of packaging the same

2006-10-31

2006-10-31

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C438S613000

Reexamination Certificate

active

07129585

ABSTRACT:
Embodiments of the invention provide a semiconductor-chip mounting body, a semiconductor device including the mounting body, and a method of packaging the semiconductor device. According to some embodiments, when a semiconductor chip is mounted on the mounting body as a flip-chip type, an encapsulation process using an encapsulation resin is not required. In some embodiments, the mounting body includes a substrate formed of a polyimide film, a conductive pattern formed of copper, a protection layer pattern formed of PSR, and an adhesive pattern formed on the protection layer pattern. The adhesive pattern can be formed of an insulating material. A plurality of holes, into which a plurality of bumps formed on the semiconductor chip are inserted to be connected to the conductive pattern, are formed in the protection layer pattern and the adhesive pattern.

REFERENCES:
patent: 6794750 (2004-09-01), Matsuda
patent: 6972381 (2005-12-01), Hashimoto
patent: 09-097815 (1997-04-01), None
patent: 1020020042486 (2002-06-01), None
English language abstract of Japanese Publication No. 09-097815.
English language abstract of Korean Publication No. 1020020042486.

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