Protective tape removing apparatus and method of assembling...

Details Protective tape removing apparatus and method of assembling... Protective tape removing apparatus and method of assembling...

2006-10-31

2006-10-31

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S464000, C029S740000, C029S743000, C156S583200

Reexamination Certificate

active

07129118

ABSTRACT:
A method of utilizing a removable protective tape to protect the active surfaces of semiconductor wafer and the individual semiconductor chips during semiconductor packaging processes is provided along with several configurations of apparatuses that may be used in such a method for removing protective tape portions from individual semiconductor chips during the assembly process.

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