4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Cheng Siew Tay

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Apparatuses and associated methods for improved solder joint...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method and apparatus for reducing electrical interconnection...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Printed circuit boards having pads for solder balls and...

Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Pcb – mcm design
Reexamination Certificate

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Thermal interface apparatus, systems, and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Thermal interface apparatus, systems, and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2378042

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