Printed circuit boards having pads for solder balls and...

Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Pcb – mcm design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S122000, C716S126000, C716S129000, C716S130000, C174S260000, C174S262000

Reexamination Certificate

active

08079011

ABSTRACT:
A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

REFERENCES:
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5815374 (1998-09-01), Howell
patent: 5875102 (1999-02-01), Barrow
patent: 5936848 (1999-08-01), Mehr et al.
patent: 6217987 (2001-04-01), Ono et al.
patent: 6217988 (2001-04-01), Yasue et al.
patent: 6365843 (2002-04-01), Shirai et al.
patent: 6414248 (2002-07-01), Sundstrom
patent: 6448504 (2002-09-01), Taguchi
patent: 6487088 (2002-11-01), Asai et al.
patent: 6607825 (2003-08-01), Wang et al.
patent: 6622905 (2003-09-01), Shier et al.
patent: 6724194 (2004-04-01), Barton
patent: 6724638 (2004-04-01), Inagaki et al.
patent: 6831234 (2004-12-01), Asai et al.
patent: 6833615 (2004-12-01), Geng et al.
patent: 7034402 (2006-04-01), Seshan
patent: 2002/0114133 (2002-08-01), Ho et al.
patent: 2003/0047348 (2003-03-01), Jessep et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit boards having pads for solder balls and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit boards having pads for solder balls and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit boards having pads for solder balls and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4253727

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.