Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Pcb – mcm design
Reexamination Certificate
2007-12-12
2011-12-13
Siek, Vuthe (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Integrated circuit design processing
Pcb, mcm design
C716S122000, C716S126000, C716S129000, C716S130000, C174S260000, C174S262000
Reexamination Certificate
active
08079011
ABSTRACT:
A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.
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Chan Choi Keng
Ngoh Wendy Chet Ming
Tay Cheng Siew
Intel Corporation
Ortiz Kathy J.
Siek Vuthe
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