Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-07-10
2007-07-10
Purvis, Sue A. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S698000, C257SE23060
Reexamination Certificate
active
11139223
ABSTRACT:
Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.
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Cheng Siew Tay, et al., Behavior of Package With Integrated Heat Spreader, Pan Pacific Symposium, Feb. 10, 2004, Surface Mount Technology Association, Intel Products (Malaysia).
Tay Cheng Siew
Wong Chee Wai
Intel Corporation
Ortiz Kathy J.
Purvis Sue A.
Soderholm Krista
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