Apparatuses and associated methods for improved solder joint...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S698000, C257SE23060

Reexamination Certificate

active

11139223

ABSTRACT:
Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are described. In this regard, according to one example embodiment, one or more strengthening pin(s) are coupled to the periphery of a package substrate, the strengthening pin(s) capable of coupling to a circuit board.

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patent: 2002/0081774 (2002-06-01), Liang et al.
patent: 2003/0001254 (2003-01-01), Jackson et al.
Cheng Siew Tay, et al., Behavior of Package With Integrated Heat Spreader, Pan Pacific Symposium, Feb. 10, 2004, Surface Mount Technology Association, Intel Products (Malaysia).

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