4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For plural devices

Cheng-hsien Chiu

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Packaging structure with coplanar filling paste and dice and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Packaging structure with coplanar filling paste and dice and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Semiconductor device protective structure and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Semiconductor device protective structure and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2391489

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