Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-10-03
2008-08-26
Ngo, Ngan (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000, C257SE21499
Reexamination Certificate
active
07416920
ABSTRACT:
The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.
REFERENCES:
patent: 7176567 (2007-02-01), Yang et al.
patent: 2006/0163727 (2006-07-01), Hedler et al.
Chang Jui-Hsien
Chao Kuang-Chi
Chiu Cheng-hsien
Lin Chihwei
Yang Wen-Kun
Advanced Chip Engineering Technology Inc.
Kusner & Jaffe
Ngo Ngan
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