Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2007-02-13
2007-02-13
Ngô, Ngân V. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S687000, C257S729000
Reexamination Certificate
active
11175420
ABSTRACT:
The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.
REFERENCES:
patent: 6531770 (2003-03-01), Nakashima
patent: 6759745 (2004-07-01), Masumoto et al.
patent: 6849940 (2005-02-01), Chan et al.
patent: 2002/0063326 (2002-05-01), Nakashima
patent: 2003/0141563 (2003-07-01), Wang
patent: 2004/0155331 (2004-08-01), Thurgood et al.
Chang Jui-Hsien
Chao Kuang-Chi
Chiu Cheng-hsien
Lin Chihwei
Yang Wen-Kun
Advanced Chip Engineering Technology Inc.
Kusner & Jaffe
Ngo Ngan V.
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