4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Chen Jung Tsai

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Apparatus for stacking electrical components using insulated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Chip stacking structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Method and apparatus for stacking electrical components...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Methods and apparatus for backlight calibration

Computer graphics processing and selective visual display system – Plural physical display element control system – Display elements arranged in matrix
Reexamination Certificate

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Ultra thin dual chip image sensor package structure and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2912076

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