Method and apparatus for stacking electrical components...

Details Method and apparatus for stacking electrical components... Method and apparatus for stacking electrical components...

2004-11-12

2008-12-09

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S686000, C257SE23031, C257SE23040

Reexamination Certificate

active

07462925

ABSTRACT:
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

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