Ultra thin dual chip image sensor package structure and...

Details Ultra thin dual chip image sensor package structure and... Ultra thin dual chip image sensor package structure and...

2007-08-21

2007-08-21

Doan, Theresa T. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S123000

Reexamination Certificate

active

11415532

ABSTRACT:
A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

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