4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Chee Keong Chin

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Integrated circuit package system with support structure for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit package system with through semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Pick-up heads and systems for die bonding and related...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2180746

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