Integrated circuit package system with through semiconductor...

Details Integrated circuit package system with through semiconductor... Integrated circuit package system with through semiconductor...

2011-01-11

2011-01-11

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S026000, C438S108000, C438S118000, C257SE21499, C257SE21508, C257SE21511

Reexamination Certificate

active

07867821

ABSTRACT:
A method of manufacture of an integrated circuit package system including: providing a package substrate; mounting a first integrated circuit die, having through silicon vias, on the package substrate; coupling cylindrical studs to the package substrate adjacent to the first integrated circuit die; and mounting a second integrated circuit die, having through silicon vias, on the first integrated circuit die and the cylindrical studs for forming an electrical connection among the second integrated circuit die, the first integrated circuit die, the package substrate, or a combination thereof.

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