Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate
2006-12-04
2011-10-18
Tolin, Michael (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
C156S285000, C156S556000, C414S752100, C414S627000, C414S737000, C294S064200, C901S040000
Reexamination Certificate
active
08037918
ABSTRACT:
Pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.
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Chin Chee Keong
Shen Guo Qiang
Wang Ya Ping
Yang Jian Ming
Slawski Brian R
Stats Chippac, Inc.
Tolin Michael
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