4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Charles William Eichelberger

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Integrated circuit test structure and test process

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Single chip modules, repairable multichip modules, and methods o

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Single chip modules, repairable multichip modules, and methods o

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Profile ID: LFUS-PAI-P-391487

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